01. Copper Material: C11000-H02/T2, Bare Copper or Tinned Copper
02. Aluminium Material: Al6060 Al6061 Al6063 Al6082
03. Insulation material: PA12,PVC, Flame retardant grade: UL94-V0
04. Dielectric strength 5KV/mm
05. Conventional Thickness: 2mm-15mm,Conventional Width: 10MM-30MM
01-Extruded Copper/Aluminium busbar
Ø Copper Material: C11000-H02/T2, Bare Copper or Tinned Copper
Ø Aluminium Material: Al6060 Al6061 Al6063 Al6082
Ø Insulation material: PA12,PVC, Flame retardant grade: UL94-V0
Ø Dielectric strength 5KV/mm
Ø Conventional Thickness: 2mm-15mm,Conventional Width: 10MM-30MM
Ø Bending Process: Formed by 3D automated CNC bending machine and CO2 laser stripped at ends
02-Introduction of Rigid Copper Busbar
Ø Rigid copper busbars are usually made of high-purity copper plate, with excellent conductivity, mechanical properties, and weldability
Ø They can carry high currents and maintain stable performance under extreme working conditions. Their surface is smooth and their resistivity is low,Which is suitable for high current and high-power electrical connections
03-Advantages of rigid copper busbar to rigid aluminum busbar
Ø Conductivity: Copper with a conductivity of 5.9 * 10 ^ 7 S/m and aluminum with a conductivity of 3.8 * 10 ^ 7 S/m.
Ø copper busbar have lower resistance and lower energy loss when transporting current
Ø Thermal stability: Copper has a higher melting point than aluminum, so copper busbars have better thermal stability in high temperature environments and are not easy to deform or melt
Ø Mechanical strength: Copper busbar have higher hardness than aluminum busbars,better mechanical strength and vibration resistance ability, and can withstand greater mechanical stress
04-Rigid Copper Busbar Manufacuring process
Ø Copper sheet material thickness 0.4mm to 8mm
Ø Conventional 01: C11000-H00 to C11000-H04(T2/Cu-ETP)
Ø Coventional 02: C10200-H00 to C10200-H04(Tu2/Cu-OF)
Ø Forming process: Laser cutting,Wire cutting,Stamping, CNC bendingCNC machining
Ø Connection method-bolt/nut connection or laser welding
Ø Rigid copper busbar plating process-nickel/tin/silver plating
Ø Rigid copper busbar insulation process-Heat shrink tube/Epoxy resin dipping coating/PVC dipping coating
Ø Application: Cell connection and Module connection of the battery pack