Rigid Copper Busbar-Nickel Plating

01-Rigid Copper Busbar Metal surface treatment technology-Nickel Plating

Ø Electrolytic Nickel Plating based on ASTM B689-97

Ø Sulfate nickel plating 5-15µm

Ø Sulfamate nickel plating 5-15µm

02-Rigid Copper Busbar Electroless Nickel Plating based on ASTM B733-22

Ø Plating thickness 1-10µm, Usually it will be 1-5µm

Ø Electroless Nickel Plating -Low phosphorus 1%-4%

Ø Electroless Nickel Plating -Middle phosphorus 4%-8%

Ø Electroless Nickel Plating -High phosphorus 8%-12%

03-Introduction of Rigid Copper Busbar

Ø Rigid copper busbars are usually made of high-purity copper plate, with excellent conductivity, mechanical properties, and weldability

Ø They can carry high currents and maintain stable performance under extreme working conditions. Their surface is smooth and their resistivity is low,Which is suitable for high current and high-power electrical connections

04-Advantages of rigid copper busbar to rigid aluminum busbar

Ø Conductivity: Copper with a conductivity of 5.9 * 10 ^ 7 S/m and aluminum with a conductivity of 3.8 * 10 ^ 7 S/m.

Ø copper busbar have lower resistance and lower energy loss when transporting current

Ø Thermal stability: Copper has a higher melting point than aluminum, so copper busbars have better thermal stability in high temperature environments and are not easy to deform or melt

Ø Mechanical strength: Copper busbar have higher hardness than aluminum busbars,better mechanical strength and vibration resistance ability, and can withstand greater mechanical stress

05-Rigid Copper Busbar Manufacuring process

Ø Copper sheet material thickness 0.4mm to 8mm

Ø Conventional 01: C11000-H00 to C11000-H04(T2/Cu-ETP)

Ø Coventional 02: C10200-H00 to C10200-H04(Tu2/Cu-OF)

Ø Forming process: Laser cutting,Wire cutting,Stamping, CNC bendingCNC machining

Ø Connection method-bolt/nut connection or laser welding

Ø Rigid copper busbar plating process-nickel/tin/silver plating

Ø Application: Cell connection and Module connection of the battery pack