Molecular Diffusion Welding-Cu to Al

01-Introduction to Copper Aluminum Molecular Diffusion Welding

Ø Copper aluminum molecular diffusion welding is an efficient and reliable metal connection technology which be widely used in industrial production

Ø For the rigid busbar,the thickness of copper/aluminum plate can be 0.5mm-5.0mm

Ø For the flexible busbar, The material will be 0.1mm or 0.2mm copper or aluminum foil

02-Principle of Copper Aluminum Molecular Diffusion Welding

Ø The metal diffusion reaction between copper and aluminum causes them to fuse at the atomic level, thereby achieving a strong connection

Ø By controlling the welding temperature, welding pressure, and welding time, the quality of the welded joint can be ensured

03-Features of Copper Aluminum Molecular Diffusion Welding

Ø High strength: The metal diffusion reaction between copper and aluminum can achieve connection at the atomic level, with good strength and sealing properties

Ø Corrosion resistance and heat resistance: Welded joints have good corrosion resistance and heat resistance, and can maintain long-term stability in complex working environments.

Ø Low cost: Copper and aluminum are common metal materials with sufficient supply in the market, making the cost of copper aluminum Molecular diffusion welding relatively low

04-Application of Copper Aluminum Molecular Diffusion Welding

Ø In the manufacturing process of new energy vehicle batteries, copper busbars are mainly used to connect the positive electrode of the battery, while aluminum busbars are mainly used for the negative electrode of the battery

Ø In the manufacturing process of batteries, copper bars and aluminum busbars need to be welded together to form a complete battery pack

Ø The significance of copper bar welding aluminum busbar technology is that it can form a strong connection between copper bars and aluminum bars, thereby ensuring the normal operation of the battery